BCO Products - Packaging Design

CUSTOM PACKAGING

• Ruggedized enclosures
• High density harnessing
• Design for thermal, shock, vibration, maintainability, EMI, human factors

ATE INTERFACE HARDWARE

• Interface adapters using COTS Interface Modules
• VME/VXI I/O panels and harnessing
• Signal conditioning, holding fixtures

PRINTED CIRCUIT DESIGN

• VME/VXI standards
• Thru hole and surface mount technologies